A convection oven with a microprocessor control is intended for board soldering of a single-piece manufacture and a small-lot manufacture with the use of soldering pastes (see fig.1).
The oven does not have a carrier, soldering is effected in the same zone by changing of heating stages. PID control initialization occurs at the first stage. Temperature linear growth is effected with the necessary slope to the set temperature value (T1) during t1 time. Jumping temperature increase to the set (T2) value is effected at the third stage. Gained temperature stabilization is effected during the (t2) set time at the fourth stage. Board double-sided heating with the help of natural convection provides high homogeneity temperature distribution without shaded effects. Strictly set temperature and soldering time (according to the specification for chip-elements, see fig.2) excludes their overheating and probability of bonding area "breakaway" at chips. The oven appearance is given in the figure. Soldering process parameters are controlled by a built-in microprocessor control system and are displayed on a matrix LED display in a text form.
Push the "Menu" button to set an operation mode. The left indicator bit shows a measured parameter: A- Ò1 temperature
|Heating stage quantity||4|
|Temperature control range at every stage||250...400 î Ñ|
|Heating zone maximum seizes||120x200 mm|
|Temperature schedule accuracy at all the stages||± 3 î Ñ|
|Power supply from 50 Hz mains, voltage||220V ± 10%|
|Maximum current consumption||26 A|